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		<title>智能 on China Infrared Heating Manufacturer</title>
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				<title>智能传感器封装红外技术</title>
				<link>http://ir-heat-china.com/zh/posts/reducing-time-costs-in-smart-sensor-packaging-infrared-vs-forced-air-convection/</link>
				<pubDate>Mon, 27 Jul 2026 08:53:54 +0800</pubDate>
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				<description>&lt;p&gt;&lt;img src=&#34;http://ir-heat-china.com/images/0ea7296bcdd661f341d1983d454c4037.png&#34; alt=&#34;智能传感器封装红外技术&#34;&gt;&lt;/p&gt;&#xA;&lt;p&gt;&lt;strong&gt;为何我们选择红外技术而非热风技术来处理传感器封装问题&lt;/strong&gt;&lt;br&gt;&#xA;如果你有过从事半导体封装工作的经验，那么你一定明白等待的痛苦——尤其是等待部件加热的那些时间。长期以来，我们一直依赖热风循环来加热部件。但说实话，这种方式效率实在太低了。&lt;/p&gt;</description>
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